Classification and specific use of flux

At present, the soldering of electronic components mainly uses soldering technology. The soldering technology uses tin-based tin alloy material as the tin material. At a certain temperature, the solder melts, and the metal weldment and the tin atom attract, diffuse and combine with each other to form a wetting bonding layer. Before welding, the surface of the weldment is tin-plated and then welded, and the welding temperature is required to make the solder material have a certain fluidity, so as to achieve the purpose of firm welding. However, the temperature should not be too high, and when it is too high, it is easy to form an oxide film to affect the quality of soldering.

The role of flux:

The main active ingredient in the flux is rosin. The rosin will decompose in the tin at around 260 degrees Celsius, so the tin bath temperature should not be too high.

Flux is a chemical that promotes soldering. In solder, it is an indispensable auxiliary material and its role is extremely important.

1) Destroy the metal oxide film to clean the solder surface, which is beneficial to the infiltration of solder and the formation of solder joint alloy.

2) Can cover the surface of the solder to prevent the solder or metal from continuing to oxidize.

3) Enhance the activity of the solder and the surface of the metal to be soldered, reducing the surface tension of the solder.

4) Solder and flux are phase-fused, which increases the fluidity of the solder and further improves the wetting ability.

5) It can accelerate the transfer of heat from the soldering iron tip to the surface of the solder and the object to be soldered.

6) A suitable flux can also make the solder joints beautiful.

(1) Dissolving an oxide film on the surface of a soldered base material

In the atmosphere, the surface of the soldered base material is always covered by an oxide film, and its thickness is about 2 & TImes; 10-9 ~ 2 & TImes; 10-8 m. When soldering, the oxide film inevitably prevents the solder from wetting the base material, and the soldering cannot be performed normally. Therefore, it is necessary to apply a flux on the surface of the base material to reduce the oxide on the surface of the base material, thereby achieving the purpose of eliminating the oxide film. .

(2) Preventing reoxidation of the soldered base material

The base metal needs to be heated during the welding process, and the metal surface accelerates oxidation at high temperatures, so the liquid flux covers the surface of the base metal and the solder to prevent oxidation.

(3) Reduce the surface tension of molten solder

The surface of the molten solder has a certain tension, just like rain falls on the lotus leaf, and the surface tension of the liquid immediately coalesces into a ball-shaped water droplet. The surface tension of the molten solder prevents it from flowing to the surface of the base material, affecting the normal progress of wetting. When the flux covers the surface of the molten solder, the surface tension of the liquid solder can be lowered, and the wetting property is remarkably improved.

(4) The role of protecting the surface of the welding base metal

The material to be welded has destroyed the original surface protective layer during the soldering process. Good flux is quickly restored to the role of protective solder after soldering.

Classification and specific use of flux

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