Singing Spring Ruifeng Optoelectronics new product release focus "big lighting, large backlight, great health"

The spring of Pengcheng seems to come earlier! With the spring thunder burst, Ruifeng Optoelectronics played the "spring new symphony."

On the afternoon of April 20th, the domestic backlight manufacturer Ruifeng Optoelectronics held a product launch conference with the theme of “big lighting, big backlight, big health” at the Lancang Bay Resort Hotel in Shenzhen. At the press conference, Ruifeng Optoelectronics introduced New products and technologies from FEMC (Flip-Off EMC Products).

Ruifeng Optoelectronics New Product Launch Conference

"The new FEMC product released this time is called the 'nuclear weapon' of flip chip." Gong Weibin, chairman of Ruifeng Optoelectronics, said that a FEMC 3030 can replace two 5730s, which can reduce the number of patches, improve efficiency and overall cost. Reduced by 30% and light output up to 3700lm.

Speech by Gong Weibin, Chairman of Ruifeng Optoelectronics

It is known that the EMC bracket is made of semiconductor-grade etched copper and thermosetting materials. The packaged LED device has the advantages of high power, high luminous efficiency, long life, low thermal resistance, small size, flexible size and easy application.

In order to fully inherit and promote the advantages of EMC brackets and flip-chip LED chips, Ruifeng Optoelectronics has developed FEMC products and successfully implemented flip-chip packaging on EMC brackets using 3D technology, which is the first in China and internationally. At the forefront. Joint international well-known equipment manufacturers and materials manufacturers, drawing on the traditional semiconductor industry process technology, developed and designed the industry-leading FEMC packaging process technology and automated production line, thus successfully breaking through the FEMC packaging technology and building a flip-chip-based LED device. New pattern. FEMC devices transform the traditional dressing method into a leadless flip-chip method on the EMC bracket platform, and introduce an automated production line, which has the advantages of high production efficiency, low device cost, high reliability, long life, and simple application. Used in the fields of indication, display, backlight, lighting, etc.

FEMC devices offer a seamless alternative to traditional off-the-shelf SMD LED devices and offer significant advantages. Firstly, the electrode of the SMD device chip is located on the light emitting surface, and the metal lead of the bonding is located above the light emitting surface, which absorbs the light of the chip and reduces the luminous efficacy of the LED. The flip-chip electrode used in the FEMC device is located at the bottom of the chip and does not affect the surface light. The lead-free package directly avoids the absorption of light by the metal lead. The surface of the chip is transparent sapphire with a refractive index between GaN and the package. It has better light matching with the encapsulant and higher light extraction efficiency. Secondly, the SMD LED bond wire is prone to problems such as virtual soldering, surge impact, insufficient current resistance, and stress cracking caused by thermal mismatch of the package rubber. It is one of the weak links in the reliability of LED devices. FEMC reduces wire bonding processes, increases productivity, and eliminates multiple reliability issues that can be caused by bond wires. In addition, the SMD device is usually made of insulating glue, and the thermal conductivity of the insulating rubber is low, which often becomes a thermal bottleneck between the chip and the bracket, affecting the heat dissipation and long-term reliability of the LED. FEMC uses a metal solid crystal material with a thermal conductivity of several hundred times that of insulating glue to directly realize the thermal, mechanical and electrical interconnection between the chip electrode and the bracket, which not only increases the mechanical strength of the product, but also greatly reduces the heat of packaging of the LED. The resistance improves the heat dissipation capability of the LED, thereby ensuring the reliability and longevity of the product.

“FEMC has significant technical advantages and application advantages compared to FSP products that are also industry hotspots and flip-chip based.” Ruifeng Optoelectronics CTO Xiao Xiaoming believes that when using the same size Flip-chip package, Compared with CSP, FEMC has more light, and FEMC has higher cost performance (lm/$). Secondly, FEMC has smaller diffusion heat resistance. Compared with chip, same current and the same ambient temperature, FEMC junction temperature is significantly lower. In addition, FEMC continues the bracket package form of the formal EMC, which has rich lens resources and excellent optical matching at the application end, and supports the customer's original SMT production line and process.

Ruifeng Optoelectronics CTO Xiao Xiaoming explains FEMC products

The introduction of Ruifeng Optoelectronics FEMC device is the first to realize the batch application of flip-chip LED chips in traditional mounting brackets, leading the LED package to fully enter the flip-chip era.

As the main market segment of LED lighting in the next three years, the filament lamp has naturally received the attention of Ruifeng Optoelectronics. At the press conference, Ruifeng Optoelectronics also launched a variety of filament lamp solutions.

“Ruifeng Optoelectronics is an LED company that has been developing filament lamps in China for a long time. It is the first in China and the first to use ceramic substrates for filaments.” Longsheng, general manager of Ruifeng Optoelectronics COB and Filament Division, said Ruifeng Optoelectronics In the field of filament lamps, it has created many domestic firsts. For example, the first one can provide 0.5V spectroscopic products, and the first mass production can reach up to 210LM/W.

Longsheng Optoelectronics COB and Filament Business Unit General Manager Long Sheng explains the filament lamp solution

According to Longsheng, the current filament production capacity of Ruifeng Optoelectronics Ningbo Plant has reached 25 KK/month, and will expand to 50 KK/month in the middle of the year. By the end of the year, the filament production capacity is expected to reach 100 KK. This expansion rate will be based on market demand at any time. accelerate.

At the same time, the conference also released a series of new products from Ruifeng, including high color gamut, ultra-thin TV backlight products, thin PCB products for smart wear and health monitoring, automotive headlight products, UV killing products, high light color quality and Smart lighting products.

Talking about the development of the backlight market in 2016, Yan Xiaoming believes that the current terminal demand declines, the backlight market is relatively fierce, and the backlight market will not have a big growth this year, but it will not be worse than 2015.

This also confirms the investigation and prediction of the High-tech Research Institute LED Research Institute (GGII). According to GGII statistics, the LED backlight market in 2015 reached 25.9 billion yuan, a 3% increase from 2014. GGII expects that the growth rate of the backlight market in 2016 will still be within 5%.

As a new technology that has been screaming in the industry in the past two years, CSP is still in a dilemma.

"At present, there is no advantage in comparison between CSP and ordinary LED products in terms of reliability and cost performance. Many companies do more CSPs than test water." Xiaoming believes that CSP has not yet met the requirements of the application, compared with CSP, Ruifeng Optoelectronics' FEMC device has an advantage.

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