(Beijing News) Guided by the Demonstration Microelectronics Institute Construction Expert Group, the Demonstration Microelectronics Institute Industry-University Integration Development Alliance, the IEEE Circuits and Systems Society (CASS), the IEEE Solid State Circuits Society (SSCS), Synopsys and Beijing Zhongguancun IC Design Development Co., Ltd. (IC Park) co-hosted the first season of the ten-day "Advanced CMOS Technology Summer School" (hereinafter referred to as "Master Class") held in Beijing today. A grand opening ceremony. This master class invites a top-level expert from the semiconductor academia or industry to give a keynote speech throughout the day. The course covers the entire chain of the integrated circuit industry from history to business to process to software to design. The specific contents include the history and prospects of integrated circuit development, the analysis of the integrated environment of the integrated circuit industry, the advanced manufacturing process of integrated circuits, and the automation simulation verification techniques. Design verification trends, layout design techniques, ESD protection circuit design techniques, RF and UHF circuit design techniques, system-level low-power design and other hot topics. This master class is aimed at young teachers in the Model Microelectronics Institute, as well as postgraduate doctors and postdoctoral students, as well as industrial technology elites. Participating in this master class will be able to get close to the academic world in the hot summer season and learn the industry's most advanced knowledge.
Microelectronics technology and integrated circuit industry are the important cornerstones of information technology development. If China wants to become a technological powerhouse, it must achieve a major breakthrough in microelectronics technology and comprehensively promote the development of the integrated circuit industry. However, at present, China's IC industry still has problems such as weak independent innovation capability, high dependence on key core technologies, and insufficient talents for high-quality microelectronics. Recently, the Ministry of Education and other six departments issued the "Notice on Supporting the Construction of Model Microelectronics Institutes in Colleges and Universities", supporting the construction of demonstration microelectronics colleges in 9 universities including Tsinghua University and Peking University, Beijing University of Aeronautics and Astronautics, Beijing Institute of Technology, etc. 17 The university is preparing to build a demonstration microelectronics college. The goal is to change the status quo of microelectronics talent shortage as soon as possible.
However, in addition to the school curriculum, the special courses with professional and international vision are of great help to the trainees to quickly improve their professional level, close contact with cutting-edge technology, and broaden their thinking and vision. In particular, the master class has unprecedented strength, including 2 IEEE Life Fellow, 6 IEEE Fellow, and 3 IEEE Senior Member. The master lecturer, close face-to-face communication, will be a feast of knowledge in the field of semiconductors.
Professor IEEE SSCS, Professor of the University of Pennsylvania, and Professor IEEE Life Fellow Jan Van der Spiegel said: "In recent years, China has shown great determination and potential in the development of integrated circuits. Chinese microelectronics students and industry engineers have knowledge of microelectronics. We have shown great enthusiasm for learning. We are very happy to hold this event together. Through a two-week high-level training course, we hope to help Chinese microelectronics college students and people from all walks of life in China IC to more accurately grasp international integration. The cutting-edge dynamics of the latest developments in circuit technology have improved their design levels."
Ren Aiguang, director of the IC Division of the Electronic Information Division of the Ministry of Industry and Information Technology, pointed out that this master class is based on the theme of "advanced COMS technology", which is one of the major gaps in China's integrated circuits. Through interaction with top international experts, we will effectively improve the existing deficiencies and improve the level of integrated circuits in China. The fundamentals of the development of the integrated circuit industry are R&D and talents. This master class has created a pragmatic atmosphere for China's industrial growth and provided a positive momentum.
Description of Stacked D-Sub I/O Connectors
Antenk's connectors are designed for applications requiring multiple connector ports with limited PCB space
The condensed footprint of Antenk's dual port D-sub solution is available in four industry sizes, three connector spacing options, and six hardware configurations for one of the broadest stacked D-sub offerings on the market in standard and high-density variations.
Stacked D-sub I/O connectors are designed for applications requiring multiple connector ports with limited PCB space. Two right angle D-sub connectors are stacked one on top of another, creating a single dual-port connector with a very condensed footprint.
Features of Stacked D-Sub I/O Connectors
Available in four industry standard sizes:
Standard density: 9, 15, 25, 37
Available in three connector spacing options: 0.625", 0.750", 0.900"
Available in six hardware configurations
High-temperature UL94 V-0 thermoplastic (260°C process temp)
High performance stamped contacts
Applications of Stacked D-Sub I/O Connectors
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