Dicotech has applied laser cutting technology developed in silicon wafer singulation and low-k film trenching to LEDs, in the laser cutting equipment market for high-brightness LED wafers. Achieved a higher share. Since the laser cutting equipment is automatically machined, it is possible to prevent uneven processing quality due to differences in skill of the processing personnel. This feature is conducive to expanding sales in the Chinese market, and the company also has high hopes.
The sapphire substrate and the SiC substrate are continuously moving toward a large diameter, and the requirements for ultra-thinning are also increasing. Therefore, the market demands to introduce devices that can thin and process large-diameter wafers automatically and at low cost. To meet this demand, DISCO Hi-Tech began offering fully automated grinding technology. According to reports, some of the LED manufacturers that have adopted large-diameter wafers have introduced the fully automatic grinding equipment equipped with the new spindles, as well as the grinding wheel and its application technology. Di Cisco Technology expects that the adoption of large-caliber wafers in the Chinese market will continue to expand in the future, and it is planned to look for business opportunities.
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