Automobile Electronic Stability Program (ESP) micro-sensors and systems achieve interim results
In the advanced manufacturing field, the 863 project "Automotive Electronic Stability Program (ESP) Microsensors and Systems" optimized the structure of MEMS gyroscopes and acceleration sensors for automotive electronics applications, and developed bulk silicon-based SOI and wafer-level packaging The low-cost MEMS micro-gyroscope and micro-accelerometer chip of the process have overcome the digital gyro circuit design and accelerometer ASIC circuit design technology and pre-molded cavity plastic packaging technology, and developed the independent intellectual property rights MEMS gyroscope and acceleration for ESP Meter product.
The subject broke through the 6-inch MEMS sensor chip process technology, adopted PCM monitoring and SPC control technology, realized the online monitoring of key process parameters of the micro sensor, established the micro sensor wafer on-chip automatic test platform, and mastered the mass production of MEMS sensors Manufacturing technology, MEMS gyroscope chip processing yield reaches 80%, MEMS accelerometer chip yield reaches 90%. Developed an automotive ESP system based on MEMS gyroscope and acceleration sensor, completed preliminary research on hardware and algorithms, matching test and carrying verification of ESP system, road test and anti-interference test of ESP system. At the same time, it is verified that the performance and reliability of the MEMS sensor meet the requirements of the ESP system. This subject has applied for 4 invention patents.
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