Technology Innovation Award: Guangyu multi-chip package high-power LED lighting (product) application technology

Project achievements (main use, technical principles, key technologies and innovations, application and benefits, problems):

1. The project “Multi-chip package high-power LED lighting application technology” was proposed by Shanxi Guangyu Semiconductor Lighting Co., Ltd., “Super-thermal conductive materials have mastered the key technologies of high-bright white LED packaging”. The project is mainly to solve the multi-chip package high-power LED technology, package high-power LED light source, and design and develop a series of LED lighting products, creating a new way for LED to be successfully applied in the field of general lighting.

2. Technical solutions and technical principles of the project:

(1) On the basis of the successful development of high thermal conductivity bonding materials, a new synthesis method and a new material doping process are adopted to develop a new insulating and thermally conductive material, reducing the thermal resistance between the light source and the heat sink, and reducing the chip junction. At the same time, the chip's anti-breakdown capability is improved to ensure the safety and reliability of the lamp.

(2) Through reasonable optical simulation, using the mature software design, further improve the existing support structure, and improve the structure of the support structure with the actual test results, so as to improve the integrated package when the new support ensures smooth heat dissipation. The purpose of the light extraction efficiency of the light source.

(3) Establish optical models and develop reflectors suitable for integrated packaged high-power LED lamps to more effectively utilize the light emitted by LEDs to improve the efficiency of lamps and meet the lighting requirements of different places.

(4) Adopting the integrated heat treatment method and providing a smooth heat transfer channel from the LED chip to the heat sink of the lamp through the thermal simulation calculation, so that the heat generated by the LED chip can be quickly and efficiently conducted into the air. , to the greatest extent, to ensure the life of the light source.

(5) Research on the reliability of lamps;

Through the research on the overall heat dissipation mechanism of the lamp, the structure of the lamp, the aging mechanism of the power supply, the aging of the LED packaging material, the deterioration of the phosphor, and the influence of static electricity on the life of the LED, the main factors affecting the reliability of the lamp are sought.