Samsung Galaxy S3 disassembly component list: use its own LTE baseband chip
ABI Research recently disassembled the Galaxy S3 E210s and found that Samsung replaced the externally supplied model with its own modem.
ABI suspects that Samsung's use of its own chip on the Galaxy S3 phone may mean that a platform war with Apple has officially begun. Both Samsung and Apple are trying to control more of the underlying semiconductor technology that drives their own device business.
ABI said that although Samsung's own Exynos brand high-end application processor is well-known, it has always used modem chips provided by Qualcomm, Intel, Broadcom, ST, Ericsson and VIA.
"In the middle of last year, Samsung launched a CDMA / LTE mobile phone using a VIA CDMA modem, Samsung LTE modem and Samsung application processor." James Mielke, vice president of engineering at ABI Research, said in a statement, "This model of the Galaxy S III The special feature of the mobile phone is that the modem chip is a single-chip HSPA / LTE modem designed and produced by Samsung itself. "
UBM Techinsights dismantled the Galaxy S3 earlier (dismantling the Samsung Galaxy S III: peeping into the "core" in the super quad-core smartphone). The smartphone found that Intel acquired the Infineon wireless business after acquiring the X-GOLD 626 PMB9811 modem chip and PMB5712 GSM / Design win for CDMA RF transceiver. However, Intel was not mentioned in the dismantling of the ABI.
In the third quarter of 2012, Samsung Galaxy S3 was the leading product in smartphones. According to Strategy AnalyTIcs statistics, the Galaxy S3 sold a total of 18 million units, a 10.7% market share in the smartphone market of 167.8 million sales. The same report showed that Apple sold 16.2 million iPhone 4S phones and 6 million iPhone 5 phones.
ABI believes that as Samsung's market share in smartphones rises, its dependence on its own chips will become a major problem for companies such as Qualcomm and VIA. Samsung also produces A6 and A6X ARM processors for Apple.
Samsung's recent acquisition of the CSR mobile phone chip business also shows that Samsung and Apple's platform war is one step closer.
The Samsung LTE / HSPA + modem (CM221S), Exynos application processor and Wolfson audio center / encoder (WM1811AE) on the Galaxy S3 E210s motherboard. Source: ABI Research
ABI dismantling Samsung Galaxy S3 LTE (SHV-E210s) shows the following components:
Samsung: 2G / 3G / 4G 40nm modem CMC221S
Samsung: Quad-core Exynos 4412 application processor
Samsung: High-performance ISP
Triquint: Four-band EDGE amplifier
Avago and RFMD: 3G power amplifier
Broadcom: BCM4334 WiFi / BT / FM conforms to wireless chip
Wolfson: WM1811AE audio center chip
Knowles: MEMS microphone
STMicroelectronics: Inertial and pressure sensors
FCI: FC7860 2G / 3G / 4G transceiver chip
Maxim: power management chip
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